• (1) STYLUS PROFILER
    Dektak XT

    The Gold Standard in Stylus Profilometry

    The DektakXT® stylus profiler features a revolutionary design that enables unmatched repeatability of 4Å and up to 40% improved scanning speeds. This major milestone combined with its other breakthroughs, uniquely enable the DektakXT to perform the critical nanometer-level film, step and surface measurements needed to power future advances in the microelectronics, semiconductor, solar, high-brightness LED, medical, scientific and materials science markets.

    Over Forty Years of Profiling Innovation
    The Dektak brand boasts the first profiler for thin film measurements, the first microprocessor-based profiler, the first profiler with 3D capability, the first PC-based profiler, and the first automated 300mm profiler. Now, DektakXT continues this legacy of pioneering “firsts” as the first stylus profiler to implement a single-arch design, the first to incorporate a true-color HD optical camera, and the first to harness 64-bit parallel processing architecture to achieve optimal measurement and operating efficiency.

    Speeding Up Collection and Analysis
    Utilizing a unique direct-drive scan stage, the DektakXT accelerates measurement scan times by 40% while maintaining industry-leading quality. Vision64, Bruker’s 64-bit parallel processing operation and analysis software, enables faster loading of 3D files and faster applications of filters and multiscan database analyses.

    Delivering Repeatable Measurements
    Implementing a single-arch structure makes the DektakXT sturdier, which reduces sources of environmental noise. DektakXT’s upgraded “smart electronics” reduce temperature variations and employ modern processors that minimize error-inducing noise, allowing it to be an even more robust system capable of measuring <10nm step heights.

    Perfecting Operation and Analysis
    Bruker’s Vision64 software complements DektakXT’s innovative design by providing the most intuitive and streamlined visual user interface. The combination of intelligent architecture and customizable automation capabilities allow for fast and comprehensive data collection and analysis. Whether you’re using a recipe to perform routine analysis on single scans, or applying custom filters settings and calculations, DektakXT’s Data Analyzer displays current data while also revealing other possible analyses.

    Making Things Easy
    The DektakXT’s self-aligning styli and assembly allows the user to quickly and easily change stylus tip size while eliminating any potential mishaps during the process. Bruker offers the widest range of stylus sizes to accommodate nearly any application need.

    Ensuring High Yield
    DektakXT provides the ability to quickly and easily set up and run automated multi-site measurement routines to verify the precise thickness of thin films across the wafer surface with unmatched repeatability. This close monitoring can save valuable time and money by improving yields.

    Unmatched performance and better than 4Å repeatability
    The Dektak XT features an innovative single-arch design that delivers breakthrough platform stability. This is combined with leading-edge "smart electronics" that establish a new low-noise benchmark for stylus profiling. Finally, the Dektak XT’s new hardware configuration offers 40% shorter collection times than prior generations.

    Unprecedented efficiency and ease of use
    The Dektak XT is equipped with Bruker’s intuitive Vision64™ user interface, which simplifies workflow and operation to make the profiler easier than ever to use for advanced analysis. In addition, the system’s self-aligning styli enables effortless tip exchange, while the profiler’s single sensor design enables the widest range of capabilities in a single platform.

    Incomparable value from the world leader in stylus profilers
    In addition to premier performance in an affordable package, the Dektak XT is available with the full complement of accessories to extend versatility and tailor the system to your specific application.
    Building on the knowledge and experience from more than forty years of stylus profiling innovations, the Dektak XT incorporates a powerful combination of industry firsts, including a unique single-arch design and smart electronics for unmatched repeatability and performance, HD true color camera for enhanced image resolution and clarity, and a 64-bit parallel processing software architecture.

    For more information, please visit:
    https://www.bruker.com/products/surface-and-dimensional-analysis/stylus-profilometers/dektak-xt/overview.html

  • (1) TRIBOLOGY / MECHANICAL TESTING
    UMT TriboLab

    The Most Versatile Tribology System Ever Designed

    Comprehensive materials testing for mechanical and triobological properties
    Bruker’s Universal Mechanical Tester (UMT) platform has been the most versatile and widely used tribometer on the market since the first model debuted in 2000. Now, newly designed from the ground up, the UMT TriboLab™ builds on that legacy of versatility with a unique modular concept that harnesses more functionality than ever before—all without any compromise in performance.

    In fact, the UMT TriboLab offers higher speeds, more torque, and better force measurement than any of its predecessors or competitors, plus it introduces powerful new features for improved efficiency and ease-of-use. TriboLab can perform practically every common tribological test on nano and micro scales. Due to its range of testing abilities and multiple possible configurations, it is used extensively across a wide variety of industries, including biomedical, microelectronics, paper, and coatings, and throughout common industrial processes in petroleum, aerospace, automobile, engine, bearing, and fastener manufacturing.

    Industry-Specific Solutions for Specialized Performance
    Bruker has utilized the versatility and modular architecture of the TriboLab platform to create turn-key kits for specific applications and industries. In addition to tailored hardware components, these modules feature software developed in conjunction with industry-leading manufacturers to address targeted standards. Bruker’s industry-specific solutions include Brake Material Screening, Clutch Friction Material Screening, 3-Point-Bend Testing, and Hot-Hardness Testing.

    Modular Drives for Maximum Versatility
    Quick changeover of drives using tool-less clamping allows the user to position the drive easily, then lock it into place in seconds. No cable connections are required for standard drives, and blind-mate connectors on the mounting ring automatically connect fans, sensors, and other electronics. Each hardware component includes a Tribo ID chip. Software interrogates the system, interprets the chip and “understands” the configuration without operator-entered commands.

    High-Load, High-Performance Sensors
    The UMT TriboLab excels at producing highly accurate and repeatable test data by utilizing the latest developments in sensor technology from Bruker. These new “Gold Series” sensors offer noise levels at an industry-leading 0.02% of full scale values, with circuitry completely redesigned to reduce noise to an absolute minimum. The range of sensors also has been extended to eleven sensors, spanning forces from 1 milliNewton up to 2 kiloNewtons.

    Complete, Uncompromised Mechanical Testing
    Researchers and industry specialists involved in the study of friction, wear, corrosion and lubricants have produced well-documented studies on the detrimental and costly impact surface degradation has on machinery, manufactured products , and manufacturing efficiency. Tribology crosses all industries, from mechanical, electromechanical, to chemical and even biological systems. Design requirements in these areas often depend heavily on very accurate friction and wear values for proper functioning of parts and assemblies, and to minimize waste.

    Controlling friction and wear is a complex science. High friction and high wear do not always equate; friction force is not proportional to load force; friction coefficients of materials are not absolute, but instead represent values obtained under specific use conditions; and environmental conditions, such as heat and moisture, can impact not only how a testing procedure is done, but the test results, as well. It’s complicated.

    Bruker’s TriboLab system is designed for tribology testing in real-world conditions. And as the most versatile, easiest to use, and most accurate tribology testing system available, it is capable of high performance testing across many industries.

    • Brake Material Screening
    • Lubricants Testing
    • Testing of Thin Films and Coatings
    • Glass Strength and Scratch Resistance
    • Oil and Gas Refinery Applications
    • Measuring Very Low Friction Forces
    • High-Temperature Materials Testing
    • Stress-Strain-Bend Testing
    • Hardmetals and Hardfacings Testing

    For more information, please visit:
    https://www.bruker.com/products/surface-and-dimensional-analysis/tribometers-and-mechanical-testers/umt-tribolab/overview.html

  • (2) STYLUS PROFILER / LARGE SAMPLE
    Dektak XTL

    Large-Format Wafer and Panel Measurement
    The Dektak XTL™ stylus profiler provides extremely accurate, repeatable, and reproducible metrology for a wide range of applications. With its ability to accommodate samples up to 350mm x 350mm, this system finally brings legendary Dektak performance to 200mm and 300mm wafer manufacturing.

    The Dektak XTL features a small footprint and integrated isolation with interlocking doors, making it ideal for today's demanding production floor environments. Its dual-camera architecture enables enhanced spatial awareness, and its high level of automation enhances manufacturing throughput. Bruker's exclusive Vision64 advanced production interface with optional pattern recognition makes data collection an intuitive and repeatable process, and minimizes operator-to-operator variability.

    New software features make the Dektak XTL the most powerful, easiest to use stylus profiler available. The system utilizes Vision64 software that is fully compatible with Bruker’s optical profiler line. The Vision64 software enables unlimited measurement sites, 3D mapping, and highly customized characterization with hundreds of built-in analysis tools.

    Also use Vision Microform software to measure shapes such as radius of curvature. Use pattern recognition to minimize operator error and enhance measurement location accuracy. Data collection and 2D and 3D analysis are in one software package with an intuitive flow. Each system comes with a Vision software license which can be installed on a separate PC with Windows 7 OS so data analysis and reports can be created at your desk.

    With its unique combination of superior performance and ease of use the Dektak XTL is the new standard for industrial thin film deposition monitoring in touch-panel, solar, flat panel display and semiconductor industries for research and QA/QC.

    Analyzes large samples
    • Encoded 300mm X/Y stage
    • Accommodates 200 & 300mm wafers
    • Up to 350mm x 350mm panels

    Industrial design
    • Integrated isolation platform
    • Incorporated keyboard/monitor
    • Small footprint workstation

    Optimized features for QA/QC
    • Pattern recognition
    • Advanced production interface
    • Interlocked doors
    • Localized GUI
    • Auto-ready kit for SECS/GEM

    For more information, please visit:
    https://www.bruker.com/products/surface-and-dimensional-analysis/stylus-profilometers/dektak-xtl/overview.html

  • (3) TRIBOLOGY / MECHANICAL TESTING / CMP
    TriboLab CMP

    Small R&D-Scale Specialty System for CMP

    Polishing Process Control for Process Development and Materials Testing
    The new TriboLab CMP Process and Material Characterization System has been designed from the ground up specifically for reliable, flexible, and cost effective characterization of wafer polishing processes.
    • Reproduces full-scale wafer polishing process conditions without downtime on production equipment
    • Provides unmatched measurement repeatability and detail
    • Allows testing on small coupons for substantial cost savings over whole-wafer testing

    The Standard for Mechanical Test Labs
    Leveraging over 20 years of CMP characterization expertise with its predecessor product (Bruker CP-4), TriboLab CMP brings a complete set of capabilities to the industry-leading TriboLab™ platform. TriboLab CMP is the only process development tool on the market that can provide a broad range of polishing pressures (0.05 - 50 psi), speeds (1 to 500 rpm), friction, acoustic emissions, and surface temperature measurements for accurate characterization of CMP processes and consumables.

    On-board Diagnostics for Better Understanding of Polishing Processes
    • Delivers more visibility into transient polishing properties than any other system on the market
    • Collects data from the instant the substrate touches the pad and throughout the entire test
    • Enables early-stage process development decisions through more complete, detailed data

    Flexibility in Sample Type, Size, and Mounting Configurations
    • Polishes any flat material, using virtually any conditioning disc, any slurry, and any pad
    • Accomodates small coupons through whole 100mm wafers with ease
    • Accepts multiple sample mounts for flexibility


    For more information, please visit:
    https://www.bruker.com/products/surface-and-dimensional-analysis/tribometers-and-mechanical-testers/tribolab-cmp-process-and-material-characterization-system/overview.html

  • AFM / LIFE SCIENCE
    JPK NanoWizard® AFM

    Specialized solutions for applications ranging from BioAFM and Polymer Research to Surface Science and NanoOptics

    The NanoWizard® is the most flexible high-end AFM on the market. It sets the benchmark in resolution, speed and stability in particular for fluid applications. All NanoWizard® systems provide true integration of AFM with optical microscopy by means of our patented DirectOverlay™ feature for precise and easy work, and comes with a large variety of options and accessories. In addition, the NanoWizard® family comes with the QI™ Mode, an easy and intuitive imaging mode for quantitative imaging.

    NanoWizard® 4 BioScience AFM
    For applications in Life Science and Soft Matter research on single molecules, living cells and tissues. The system combines highest usability with high-quality measurements. Cutting-edge technology from the pioneers of BioAFM.

    NanoWizard® 4 NanoScience AFM
    For applications in materials and polymer science ranging from nanomechanics and electrochemistry to electrical and magnetic measurements.

    BioMAT™ Workstation
    For opaque samples, combining upright optical microscopy with AFM for surface science and life science.

    NanoWizard® Sense AFM
    The best start in AFM for applications in materials and life science.

    NanoWizard® ULTRA Speed 2 AFM
    High-speed imaging and super-resolution AFM on inverted microscopes, paired with unparalleled flexibility.

    NanoWizard® NanoOptics AFM
    Comprehensive solution for advanced experiments which combine AFM and optical spectroscopy such as TERS, Aperture SNOM and sSNOM, confocal microscopy and nano manipulation in optical fields.

    OT-AFM Combi-System
    NanoTracker™ & NanoWizard® - Powerful combination of Optical Tweezers & AFM in one system for force measurements in 2D and 3D from 500fN to 10nN.

    For more information, please visit:
    https://www.jpk.com/products/atomic-force-microscopy

  • AUGER ELECTRON SPECTROSCOPY (AES) / SURFACE ANALYSIS / SPECTRAL ANALYSIS
    PHI 710

    Auger Electron Spectroscopy (AES, Auger) is an analytical technique that provides compositional and distributional information of elements on the top few monolayers of a material by irradiating an electron beam to the surface of a solid material and measuring the energy of Auger electron emitted from the sample surface. The PHI 710 Scanning Auger Nanoprobe is a high performance surface analysis system that provides nanometer level Auger analysis. The acoustic enclosure and the built-in vibration isolators allow compositional and distributional measurement by 500,000 magnification that conventional Auger system never achieved.

  • CONFOCAL SOUND ACOUSTIC MICROSCOPE / ELECTRONICS
    C-SAM (AW Series)

    The AW™ Series are advanced high-capacity, high throughput, automated C-SAM® instruments specialized for maximum sensitivity for evaluation of wafer bond applications. The AW Series delivers a better than 5 micron sensitivity, throughputs that are approximately two times faster than competitive systems and non-immersion scanners that eliminate false positives due to DI water ingression. The AW Series automatically handles, inspects and sorts boned wafers based on user-defined accept/reject criteria and are designed to handle wafers bonded by virtually any method, including direct fusion, anodic, glass frit and epoxy bonding.

  • CONFOCAL SOUND ACOUSTIC MICROSCOPE / ELECTRONICS / PRODUCTION
    D24

    The D24™ is a semi-automated factory floor instrument capable of scanning boards and samples up to 24”, or accommodating up to six JEDEC trays of components at one time. The D24 delivers the robustness and accuracy of Sonoscan’s top lab instrument, but with very large area coverage capabilities. Plus, the analysis can be programmed to be performed without operator assistance, freeing your personnel for other duties while the inspection is in progress.

    The D24 accommodates even the largest boards and permits acoustic micro imaging of components mounted on the board. During the initial scan, each component is inspected while the D24 learns the x-y coordinates of each. It also learns the z coordinate and, equally important, the specific internal depth to be scanned. For a flip chip, for example, the level of interest may be the die-to-underfill interface. For a conventional IC package or a BGA, the level of interest may be the die attach. The D24 software can even store gating information for two or more depths of interest per component.

    Because not all components will have the exact same position from board-to-board, the D24 intelligently detects the x, y, and z coordinates and makes minor adjustments as needed, storing a detailed and highly accurate acoustic image of each component. It can also automatically analyze each image. For example, if it detects a void in a die attach layer, software measures the area of the void as a percentage of the whole die attach area. This makes it much easier to comply with standards such as Mil-Std-883, Method 2030, and makes it easier to determine the level of significance of any single defect.

    At the end of the scan, you’ll have a clear ""acoustic picture"" of the board. If there are a few components which should be replaced, you’ll know exactly which components they are, and the reason for rework. If the same component is defective on board after board, the problem can be identified and solved. The result is defect-free output with potentially no reduction in total throughput.

  • CONFOCAL SOUND ACOUSTIC MICROSCOPE / ELECTRONICS / QUALITY CONTROL
    C-SAM (GEN 6)

    The Gen6™ C-Mode Scanning Acoustic Microscope is the newest generation in Acoustic Microscopy Imaging (AMI) innovation. While taking the best from the Gen5™ (e.g. advanced features, aesthetics, and ergonomics), the Gen6 improves upon the rest and takes acoustic imaging to the next level.

    The Gen6 delivers the broadest range of capabilities available. Whether your needs are for nondestructive failure analysis, process development, R&D, High-Rel qualification for a military application, or low/medium-volume screening, the Gen6 is the one C-SAM system that can meet all of your demands. Gen6 is perfect for a variety of applications, such as; Microelectronics, MEMS, SSL LEDs, Power Modules, Solar, High-Tech materials, etc.

    As the ultimate laboratory analysis tool, the Gen6 includes SonoSimulator as a standard feature to simplify the analysis of devices with multiple thin layers.

    Advanced Sonoscan capabilities such as PolyGate™, Virtual Rescanning Mode (VRM™), and available Frequency Domain Imaging (FDI™) add value and confidence. With its large, easy-access, illuminated scanning area, the Gen6 has the capability to efficiently scan everything from a single part, to a 300mm wafer, with its tower referenced scan and fixtures.

    In addition to being packed with leading Sonoscan innovations, the Gen6 was carefully designed with the user in mind. Its ergonomic features make it comfortable and convenient to use. Its advanced applications Sonolytics™ software and new intuitive operator interface menus help maximize results, while saving operator time. Plus, its open access and illuminated tower referenced sample stage allow for easier loading and unloading of samples. The Gen6 is truly the new generation C-SAM, delivering a package of technology, ergonomics, and advanced Sonoscan-developed features that cannot be found anywhere else.

  • Handheld XRF
    Vanta

    The Vanta analyzer is our most advanced handheld X-ray fluorescence (XRF) device and provides rapid, accurate element analysis and alloy identification to customers who demand laboratory-quality results in the field.

    Vanta handheld XRF analyzers are built to be tough. Their rugged and durable design makes them resistant to damage for greater uptime and a lower cost of ownership.

    With intuitive navigation and configurable software, the Vanta series are easy to use with minimal training for high throughput and a fast return on investment. Featuring innovative and proprietary Axon technology, Vanta analyzers give you accurate results and help boost productivity no matter the environment or working conditions.

    Exceptional durability under extreme conditions.
    Analytical superiority.
    Optional Wireless LAN and Bluetooth® for real-time data sharing. Cloud technology enabled.
    Intuitive user interface.

  • Handheld XRF
    Delta Element

    The DELTA Element is the most affordable unit in the Olympus line-up of handheld X-ray fluorescence (XRF) analyzers designed for fast, accurate results. Fast, simple and reliable, the DELTA Element incorporates the features and rugged design of the DELTA family. With fast elemental ID for screening, sorting and metal analysis, the DELTA Element provides fast ROI for Scrap, PMI, QA / QC and Jewelry / Precious Metals applications.

    With a powerful X-ray tube and Si-PIN detector, the DELTA Element is ideal for simple applications. It provides quick ID, screening, sorting and elemental and metal analysis.

    The DELTA Element offers fast measurement with results in seconds, low limits of detection, and outstanding precision.

    The DELTA Element's field-worthy and rugged design features rubber overmolds and an ergonomic grip to protect the analyzer. To avoid downtime, the hot swap feature allows the batteries to be swapped out while the analyzer is in use. The DELTA Element features wide area heat sinks for high power use in extreme temperatures.

    Olympus' exclusive Grade Match Messaging (GMM) feature provides information to simplify verification and streamline operations. Users can assign customized messages to any grade and use real-time or pop-up messages for immediate sorting instructions and improved user efficiency.

  • NanoIndenter
    TI 980 TriboIndenter

    One Giant Leap for Nanomechanical & Nanotribological Testing

    Bruker’s Hysitron TI 980 TriboIndenter
    The Hysitron TI 980 nanoindenter is Bruker's latest, most advanced nanomechanical test instrument that lies at the intersection of maximum performance, flexibility, reliability, usability, and speed. The Hysitron TI 980 nanoindenter is the next-generation of Bruker's renowned Hysitron TriboIndenter product family, building upon decades of technological innovation to deliver a new level of extraordinary performance, enhanced capabilities, and ultimate versatility in nanomechanical and nanotribological characterization.

    Keeping You at the Forefront of Materials Discovery and Development
    Powered by Bruker's Performech® II Advanced Control Module, the TI 980 Nanoindenter delivers remarkable advances in control and throughput capabilities, testing flexibility, applicability, sensitivity, measurement reliability, and system modularity. The TI 980's powerful base configuration includes quantitative nanoscale-to-microscale indentation, nanoscratch, nanowear, high resolution in-situ Scanning Probe Microscopy imaging, dynamic nanoindentation, and high speed mechanical property mapping; providing a comprehensive understanding of material behavior at the nanoscale.

    Simplicity and Speed of Automation
    The Hysitron TI 980 provides rapid, multi-sample and multi-technique automated testing capabilities for high-throughput characterization. Smart automation routines validate probe shape at user-defined intervals, and its high resolution multi-scale imaging with whole-sample optical surveying streamlines the testing process.

    Futureproof Characterization Potential
    The TI 980 Nanoindenter was developed with maximum flexibility in mind, knowing your characterization needs today will likely be different in the future. The TI 980 supports the largest range of hybrid and correlative nanomechanical characterization techniques, promising to keep your research and materials development at the forefront of technology. Combined with versatile system control and data analysis software, universal sample mounting options (mechanical, magnetic, and vacuum), and a modular environmental enclosure, the TI 980 will adapt to your future characterization requirements.

    For more information, please visit:
    https://www.bruker.com/products/surface-and-dimensional-analysis/nanomechanical-test-instruments/standalone-nanomechanical-test-instruments/ti-980-triboindenter/overview.html

  • NanoIndenter
    TI 950 TriboIndenter

    Nanomechanical Test Instrument

    Bruker’s TI 950 TriboIndenter
    Hysitron TI 950 TriboIndenter nanoindenter has been developed as an automated, high throughput instrument to support the numerous nanomechanical and nanotribological characterization techniques developed by Bruker. The Hysitron TI 950 nanoindenter system incorporates the powerfulperformech® I Advanced Control Module, which greatly improves the precision of feedback-controlled nanomechanical testing, provides dual head testing capability for nano/micro scale connectivity, and offers unprecedented noise floor performance. The numerous nanomechanical testing techniques offered by Bruker, as well as new testing methods currently being developed, make the HysitronTI 950 TriboIndenter an extremely versatile and effective nanomechanical characterization tool for the broadest range of applications.

    Superior Control and Sensitivity
    The combination of Bruker’s performance-leading feedback control algorithms and superior measurement sensitivity provides precise control for all Hysitron nanomechanical testing techniques. All feedback control functionalities on the Hysitron TI 950 are carried out by a dedicated digital-signal processor (DSP) and field-programmable gate array (FPGA) embedded control system to accurately follow the inputted request of the user.

    Capacitive Transducer Technology
    Proprietary capacitive transducer technology provides unprecedented measurement sensitivity (<30 nN, <0.2 nm), accuracy, and reliability during the nanoindentation process. Electrostatic actuation uses little current, enabling superior drift characteristics that result in faster data acquisition, higher accuracy, and better repeatability.

    High-Resolution Optics with In-Situ SPM Imaging
    Top-down optics with a color CCD camera have been incorporated into the Hysitron TI 950 TriboIndenter for high magnification and visual observation of sample surfaces and the selection of testing locations. For greater precision in probe placement, in-situ SPM imaging can be used to refine the probe position to within ±10 nm. The dual modes of imaging provided by the Hysitron TI 950 allow precise positioning of the probe to accommodate the multitude of applications for which it is used.

    For more information, please visit:
    https://www.bruker.com/products/surface-and-dimensional-analysis/nanomechanical-test-instruments/standalone-nanomechanical-test-instruments/ti-950-triboindenter/ti-950-triboindenter-overview.html

  • NanoIndenter
    TI Premier

    Hysitron TI Premier

    Enabling Quantitative Nanomechanical Research
    Bruker's Hysitron TI Premier Series was specifically designed to deliver industry-leading, quantitative nanomechanical characterization within a compact platform. Built upon proven Hysitron technology, the Hysitron TI Premier provides an essential toolkit for your nanoscale mechanical and tribological testing. Routine measurements to advance research can be accomplished utilizing the versatile base configurations of the Hysitron TI Premier, while numerous technique upgrade options are available to meet the potential diversity of your future characterization needs.

    The Hysitron TI Premier is adaptable to meet specific research needs. Common configurations include:

    Quasi-Static Nanoindentation
    Multipurpose configuration, optimized for mechanical characterization of thin films and coatings.

    High Temperature Nanoindentation
    Investigate mechanical properties and time-dependent deformation behavior as a function of temperature, up to 800°C.

    Dynamic Nanoindentation
    Quasi-static and dynamic mechanical property characterization over a broad range of materials, from ultra-soft to ultra-hard.

    Multi-Scale Indentation
    Depth-sensing indentation over the nanometer and micrometer length scales.

    For more information, please visit:
    https://www.bruker.com/products/surface-and-dimensional-analysis/nanomechanical-test-instruments/standalone-nanomechanical-test-instruments/ti-premier/overview.html

  • PORTABLE STRESS ANALYZER / NON-DESTRUCTIVE
    SmartSite RS

    The SmartSite RS is the world’s smallest portable stress analyzer that is especially designed for field analysis. It enables to characterize residual stress of metal parts ranging from large construction projects to individual products, e.g. bridges, maritime vessels, aircraft, aerospace equipment, pipelines, heavy machinery and automobiles.

  • Portable XRD
    Terra

    The TERRA Mobile XRD System, a high performing, completely contained, battery operated, closed-beam portable XRD, provides full phase ID of major, minor and trace components with a qualitative XRF scan of elements Ca - U. Its unique, minimal sample prep technique and sample chamber allow for fast, in-field analysis.

  • RESIDUAL STRESS MEASUREMENT
    AutoMATE II

    Residual stress may be created during the manufacturing process of a material, or it may accumulate in a structure over many years in operation. In either case, this stress can have a serious negative effect on a product's quality, durability and lifetime. Accurate detection of residual stress is an important element of the quality control process and helps predict the service lifetime of products.

    In the past, if you wanted to make highly accurate residual stress measurements, you had to use an R&D diffractometer because of the accuracy of the goniometer. However this restricts the weight and size of the samples you can measure. On the other hand, dedicated laboratory and factory-floor residual stress analyzers suffer from reduced accuracy due to the nature of their mechanical designs, while, in their favor, they have the flexibility of measuring large and heavy parts.

    With the AutoMATE II, you now have the best of both worlds. Large and heavy parts (30 kg with standard manual Z stage; 20 kg with optional automated XYZ stage) can be measured with high accuracy. This is possible because the X-ray source and detector arm are mounted on a highly accurate two-axis goniometer that can position them relative to the measurement site and perform scans with an accuracy of 0.1 microns when using the automated XYZ stage.

    The most advanced new feature of the AutoMATE II lies in an innovative new X-ray detector. The detector used in the AutoMATE II is the D/teX Ultra1000, an electronic Si strip detector that has high dynamic range, high sensitivity, and good energy resolution, as well as not requiring any consumable gas.

  • SCANNING ACOUSTIC MICROSCOPE / ELECTRONICS
    FastLine™ P300™

    "The FastLine™ P300™ Acoustic Microscope is specifically designed for accelerated inspection throughput in manual screening of microelectronic devices on the manufacturing floor. With an integrated design to minimize footprint, the FastLine is the new platform for Acoustic Microscopes.

    Every detail of the FastLine™ P300™ was engineered to match the way customers use Acoustic Microscopes for non automated production and process control. Simultaneous loading and scanning with Sonoscan’s unique carrier system allows one JEDEC style tray or reference tray to be scanned while a second tray is being safely loaded. The whole inspection process (handling, scanning and analysis) was considered, yielding the highest possible throughput.

    The new, more ergonomic design helps maximize productivity and improves the overall operator experience while minimizing the instrument footprint. FastLine™ P300™’s new Sonolytics™ Operator Interface, designed with the operator in mind, allows technicians to work with simplified and expanded features for production/process use in multiple languages.

    In addition, FastLine™ P300™ features a new electronics platform to meet current and next generation applications. New Movement Map™ technology delivers precise transducer positioning, while the Visual Poly-Gate™ mode allows for simple and instant multiple depth imaging. These innovative features along with the higher speed scanning mechanism make the FastLine™ P300™ system essential for any production line application.
    "

  • SCANNING ACOUSTIC MICROSCOPE / ELECTRONICS
    FACTS² ™

    "The FACTS²™ delivers state-of-the-art, automated in-line inspection for quality and process control. Delivering high throughput with minimal operator interaction, FACTS² simultaneously inspects two trays or modules with precision of ± 0.5 microns and utilizes multiple scan heads, improving throughput between two and seven times that of previous tools.

    FACTS²™ automatically inspects parts in JEDEC trays or Auer Boat carriers as part of an in-line process, ideal for high volume production environments. In addition, the FACTS² can also handle lead frame strips, IGBT power modules, multi-layer ceramic chip capacitors, flip chips and other components. The scanners utilize linear motor drives and mechanisms that virtually eliminate vibration by inertial balancing. Eliminating vibration and sample motion during scans allows for very narrow and precise layers of the samples to be isolated, gated and analyzed. This delivers the industry’s fastest image acquisition times.

    Once inspected, trays are moved to the drying chamber while a new inspection begins. Any previously hidden internal packaging defects, including voids, disbonds, delaminations and cracks, are clearly identified. Batch and lot data can be accessed either as images or tabulated analysis data from spreadsheets and tray maps. If desired, accept/reject criteria can be set to identify defective components within the data automatically. Defects can also be sorted into various categories based on your specific quality standards.

    Equipped with our industry preferred Sonolytics software platform and an SECS-II/GEM E30 interface—allowing for data to be tracked electronically via instrument-to-host communications in your factory environment, the FACTS² delivers the fastest automation inspection with maximum flexibility and is the ideal solution for production environments."

  • SCANNING ACOUSTIC MICROSCOPE / ELECTRONICS
    D9™ Series

    The D9™ Series represents the modern standard for laboratory C-SAM instruments, specializing in failure analysis, process development, material characterization and low volume production inspection. Amply loaded with today's most advanced software, these instruments incorporate robust and accurate scanning features and expansive user conveniences to raise the performance level for laboratory acoustic microscopes. The D9 Series operates in both reflection and transmission modes, ensuring that all types of defects are correctly identified with the highest quality acoustic images available. The D9 Series makes scanning larger samples and trays of samples fast, easy and incredibly accurate.

  • SEM / AUTOMATED
    Aspex

    The Aspex Explorer is a designed for the automated imaging and elemental analysis of a wide spectrum of surfaces and particulate. The Aspex Explorer seamlessly provides high imaging, rapid non-destructive compositional analysis, and robust automation for size, shape and elemental composition.
    The Aspex Explorer is a microanalysis system that provides a fully integrated platform for addressing the micro-scale visualization of key surface features, as well as the needs of a diverse range of industries where stringent cleanliness and particle or inclusion contamination is critical. Its small physical footprint and low cost of ownership make it an ideal solution for operations interested in improving reliability and quality, while also minimizing production inefficiencies.

    A variety of industries from forensics to health sciences, to steel and automotive rely on the rugged hardware and sophisticated software of the Aspex Explorer as a fast and reliable platform for identifying particles as well as surface features.

    The Aspex Explorer with Automated Feature Analysis (AFA), provides a fast, accurate way for manufacturers in many industries to monitor and control the presence of contaminants that affect the quality of their products. For example, automotive parts manufacturers must control the level of particulate contaminants, which can cause failures in the field and impact their warranty programs. Steel makers are concerned with non-metallic inclusions, which degrade steel quality and can clog nozzles in production equipment. Monitoring the number and type of inclusions lets them adjust production chemistry to reduce the number of pour-backs and improve the quality of their products. AFA is valuable whenever rapid feedback of large sets of particle data is needed. The data sets can be trended and reviewed in real-time to identify and correct process issues. The ability to monitor and optimize an industrial process is critical for maximizing production efficiency and cost savings or ultimately, the profitability of the operation.

  • TOF-SIMS / SURFACE ANALYSIS
    PHI nanoTOF II

    Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS) is a surface analysis technique that provides compositions and images of surface molecules and elements with a top few atmic layers. TOF-SIMS can analyze from H+ to high mass number molecule ion (> 10.000amu) with a high mass resolution.
    PHI TRIFT V nanoTOF ™ achieves high spatial resolution and mass resolution by using triple focus hemispherical electrostatic analyzer which has excellent ion transmitting characteristics.PHI TRIFT V nanoTOF ™ also has high ability that can image samples with complex geometries without shadowing.

  • WDXRF / BENCHTOP
    Supermini200

    The new Supermini200 has improved software capabilities as well as a better footprint. As the world's only high-power benchtop sequential wavelength dispersive X-ray fluorescence (WDXRF) spectrometer for elemental analysis of oxygen (O) through uranium (U) of almost any material, the Rigaku Supermini200 uniquely delivers low cost-of-ownership (COO) with high resolution and lower limits-of-detection (LLD).

  • WDXRF / SIMULTANEOUS
    Simultix 14

    The newest version of our popular multi-channel simultaneous wavelength dispersive X-ray fluorescence (WDXRF) spectrometer system is the Simultix 14. Based on over 30 years of accumulated experience, the Simultix 14 stands out as the most advanced, fully automated system available — designed to meet today's analytical needs for utmost sensitivity, throughput, and versatility.

  • XPS / SURFACE ANALYSIS / AUTOMATED
    PHI Quanterra II

    The Quantera II is the next generation of PHI’s highly successful scanning XPS microprobe product line. The Quantera II provides high sensitivity large and micro-area spectroscopy, superior inorganic and organic depth profiling, and the fully automated analysis of insulating or conductive samples.

    Important features of the Quantera II include:
    High sensitivity large area spectroscopy
    High performance micro-area spectroscoy
    Patented scanning x-ray source with a < 7.5 µm minimum beam size
    Secondary electron and XPS imaging
    Highest performance inorganic and organic sputter depth profiling
    Optional C 60 sputter ion gun
    Hands-off dual beam charge neutralization
    Robust ""Auto-Z"" sample alignment
    Robotic sample handling
    Fully automated and internet ready for remote operation
    Micro area spectroscopy and high performance thin film analysis capabilities open new areas of application for XPS surface analysis in all environments. The complete automation of the system makes it easy to use and increases the reproducibility of routine measurements. Large sample platens make it possible to analyze “real world” large samples or multiple small samples automatically. A new generation of XPS surface analysis instruments are available today from PHI.

  • XPS / SURFACE ANALYSIS / MID-RANGE
    PHI X-Tool

    The PHI X-tool is the newest member of PHI’s suite of XPS instruments that also includes the PHI Quantera II and PHI VersaProbe II. The X-tool is designed to make XPS instrumentation accessible to a larger audience. An intuitive touch screen user interface, automatic sample loading, automatic analysis, and automatic report generation removes the requirement to be a surface analysis expert to perform XPS measurements.

    Based on PHI’s patented scanning XPS microprobe technology, the X-tool provides a robust environment for performing routine small and large area XPS measurements.

    In the automatic mode of operation a turnkey recipe driven analysis capability for repetitive analysis tasks or process monitoring is provided.

    In the interactive mode of operation, the user can define analysis conditions and guide an interactive research or failure analysis oriented analysis session. Analysis capabilities include: small and large area spectroscopy, XPS mapping, and sputter depth profiling. An internal optical microscope and x-ray beam induced secondary electron imaging are available to guide the selection of areas for analysis.

    If your XPS application is centered around repetitive analysis tasks or the need to make XPS available to a large group of users, the X-tool was designed for you.

  • XPS / SURFACE ANALYSIS / MULTI-TECHNIQUE
    PHI VersaProbe II

    The VersaProbe II is the next generation of PHI's highly successful Multi-Technique Scanning XPS Microprobe, which features a new software user interface for instrument operation and a new 128 channel detector. The VersaProbe II is based on PHI’s scanning x-ray microprobe technology, that provides high performance XPS large area spectroscopy, superior micro-area spectroscopy, chemical imaging, and secondary electron imaging with a raster scanned 10 µm diameter x-ray beam.

    PHI’s innovative and patented dual beam charge neutralization method provides turn-key analysis of insulating samples using a combination of low energy ions and electrons.

    The integral floating column argon ion gun provides an impressive sputter depth profiling capability for inorganic thin film structures. Optional C60+ and Ar2500+ cluster source ion guns provide a unique and powerful organic sputter depth profiling capability.

  • XRD / HIGH RESOLUTION
    SmartLab (XRD)

    The SmartLab is the most novel high-resolution diffractometer available today. Perhaps its most novel feature is the SmartLab Guidance software, which provides the user with an intelligent interface that guides you through the intricacies of each experiment. It is like having an expert standing by your side.
    The system incorporates a high resolution θ/θ closed loop goniometer drive system, cross beam optics (CBO), an in-plane scattering arm, and an optional 9.0 kW rotating anode generator.
    Coupling a computer controlled alignment system with a fully automated optical system and the Guidance software makes it easy to switch between hardware modes, ensuring that your hardware complexity is never holding back your research.
    Whether you are working with thin films, nanomaterials, powders, or liquids the SmartLab will give you the functionality to make the measurements you want to make when you want to make them.

  • XRD / HIGH RESOLUTION
    SmartLab 3 (XRD)

    The SmartLab 3 is a highly versatile multipurpose X-ray diffractometer with built-in intelligent guidance. It offers continued refinement of the original ease of use features that enabled the original SmartLab to receive the R&D 100 Award in 2006: automatic alignment, component recognition, cross beam optics and a five axis goniometer.

  • XRF / WDXRF
    ZSX Primus (XRF)

    Rigaku ZSX Primus delivers rapid quantitative determination of major and minor atomic elements, from beryllium (Be) through uranium (U), in a wide variety of sample types — with minimal standards.
    The latest instrument in Rigaku's ZSX series, the ZSX Primus continues the tradition of delivering accurate results in a timely and seamless manner, with unsurpassed reliability, flexibility, and ease of use to meet any challenges in today's laboratory.
    Providing superior performance with the flexibility for analyzing the most complex samples, the ZSX Primus features a 30 micron tube, the thinnest end-window tube available in the industry, for exceptional light element (low-Z) detection limits. Combined with the most advanced mapping package to detect homogeneity and inclusions, the ZSX Primus allows easy detailed investigation of samples that provide analytical insights not easily obtained by other analytical methodologies. Available multi-spot analysis also helps to eliminate sampling errors in inhomogeneous materials.
    EZ-scan allows users to analyze unknown samples without any prior setup. This time saving feature requires only a few clicks of the mouse and a sample name to be entered. Combined with SQX fundamental parameters software, it provides the most accurate and rapid XRF results possible. SQX is capable of automatically correcting for all matrix effects, including line overlaps. SQX can also correct for secondary excitation effect by photoelectrons (light and ultra-light elements), varying atmospheres, impurities and different sample sizes. Increased accuracy is achieved using matching library and perfect scan analysis programs.

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