Crest is excited to participate in IPFA 2025 – the 32nd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits!

đź“… Join us at this premier event where experts in semiconductor reliability, materials characterization, and failure analysis come together to exchange insights and innovations.

🤝 Our team would love to connect! If you’re attending, feel free to reach out and schedule a time for meeting  during the event.

Let’s talk about how we can support your lab’s analytical needs.

Date Icon5 - 8 Aug 2025
Location IconSpice Convention Center

Join us at this premier event where experts in semiconductor reliability, materials characterization, and failure analysis come together to exchange insights and innovations.

 

nano

Nanoprobing SEM Solution

Nanoprobing SEM Solution enables precise electrical characterization and manipulation at the nanoscale by integrating nanoprobing tools within a Scanning Electron Microscope, ideal for failure analysis, device testing, and material research.

Bruker Lumos II

Fourier Transform Infrared Spectroscopy | FTIR

FTIR is a powerful analytical technique used to identify and characterize materials based on their infrared absorption spectra. It provides detailed information about a sample’s molecular composition, chemical bonds, and functional groups — making it essential for quality control, material verification, and failure analysis.

Tescan Tima

Scanning Electron Microscope | SEM

A Scanning Electron Microscope (SEM) uses focused beams of electrons to produce high-resolution images of a sample’s surface, providing detailed information about its topography, composition, and morphology at the micro- to nanoscale.

PHI GENESIS

X-ray Photoelectron Spectroscope (XPS)

X-ray Photoelectron Spectroscopy (XPS) is a surface-sensitive analytical technique that measures elemental composition, chemical states, and electronic structure by detecting electrons emitted from a material when irradiated with X-rays.

TDM Compact 3

Topography & Deformation Measurement

Topography & Deformation Measurement involves analyzing surface features and tracking changes in shape or structure under stress, providing critical insights into material behavior, wear, and mechanical performance.

Dimension IconIR300

Atomic Force Microscopes | AFM

Atomic Force Microscopes (AFM) provide high-resolution 3D surface imaging by scanning a sharp probe over a sample, enabling nanoscale analysis of topography, mechanical properties, and material interactions.