Crest is excited to participate in IPFA Workshop at IPFA 2025 – the 32nd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits!

📅 Join us at this IPFA Workshop where experts in correlative Micro-CT, Laser, and Plasma FIB for Advanced Device Integration failure analysis come together to exchange insights and innovations.

🤝 Our team would love to connect! If you’re attending, feel free to reach out and schedule a time for meeting  during the event.

Let’s talk about how we can support your lab’s analytical needs.

Date Icon7 Aug 2025
Location IconBreakout Room: D3, Spice Convention Centre, Penang, Malaysia.

TESCAN FIB-SEM, STEM, and micro-CT Technology

Driving Breakthroughs in Semiconductor Manufacturing and Analysis

Step into the future of semiconductor innovation with TESCAN’s advanced FIB-SEM, STEM, and micro-CT tools. Our cutting-edge solutions support research, defect analysis, and process optimization.

Whether you’re advancing DRAM memory technologies, 3D NAND, or logic devices, TESCAN delivers precision and efficiency across the entire semiconductor manufacturing process, including power semiconductor devices.

TESCAN SOLARIS X 2

TESCAN SOLARIS X 2

Perform failure analysis on complex IC packaging and prepare gallium-free TEM lamellae with the advantages of Xe Plasma FIB.

TESCAN AMBER X 2

TESCAN AMBER X 2

Achieve artifact-free delayering at sub-10 nm nodes with low kV Plasma FIB milling.