The Complete X-ray Inspection Solution

X-Series

 

The AXI X Series is a highly advanced and reliable solution designed for automated X-ray inspection in electronics manufacturing. Built for precision and speed, the AXI X Series offers exceptional imaging capabilities to ensure the highest quality in inspecting complex assemblies and components. It is ideal for applications such as PCB assembly, semiconductor inspection, and component failure analysis.

With cutting-edge X-ray technology, the AXI X Series can detect even the smallest defects and structural issues, making it an indispensable tool for quality control and defect detection. Whether you're inspecting solder joints, component alignment, or hidden defects inside a product, the AXI X Series guarantees accuracy and efficiency, enabling manufacturers to maintain high standards of production quality.

Key Features

  • High-Resolution Imaging: Offers superior X-ray image quality, allowing detection of microstructural defects with fine detail.
  • Automated Defect Detection: Utilizes advanced algorithms and AI-driven image analysis for automatic defect detection and classification.
  • Seamless Integration: Easily integrates with automated production lines for continuous inspection without interruption.
  • Versatile Inspection: Suitable for a wide range of applications, including PCB, semiconductor, and automotive components.
  • User-Friendly Interface: Intuitive software interface for easy operation and minimal training time.

Specifications

Feature Specification
X-ray Source Type Sealed tube, 130 kV/40W
Detector Type CMOS Flatpanel Detector, 50 µm pixel size (6 MPix)
Resolution 3-4 µm/pix
Inspection Area Up to 460mm x 360mm
Sample Size From 80 mm x 80 mm to 460mm x 360mm
Inspection Speed Transmission up to 6 views /s
Motion System Multiple axes programmable motion system
Software Nordson AXI proprietary software with full traceability
System Dimensions (L x W x H) 1800 mm x 1575mm x 1630mm
Weight 2,800 kg (approx.)

 

Applications

  • PCB Assembly: Ideal for detecting solder joint defects, component placement issues, and voids in complex PCB assemblies.
  • Semiconductor: Perfect for inspecting microelectronics and chips for structural integrity and hidden faults.
  • Automotive: Inspects automotive components for critical failure points in areas such as engine electronics and sensors.
  • Medical Devices: Ensures the integrity of medical components and devices with precision X-ray inspections.
  • Contract Manufacturing: Provides outsourced manufacturers with automated, high-throughput inspection capabilities.
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