Dektak XTL – High-Throughput Stylus Profiler

Product Overview
The Dektak XTL™ is a next-generation stylus profiler optimized for large-format samples up to 350 mm, delivering industry-leading repeatability, precision, and ease of use for production-floor metrology. Designed with dual-camera control, a high-accuracy encoded XY stage, and Bruker’s Vision64® software, the Dektak XTL provides fast, gage-capable measurements of step height, thin film thickness, surface roughness, and 3D profiles.
Its enclosed workstation, robust automation, and passive pneumatic isolation make it ideal for cleanroom and production-line use across sectors such as semiconductors, flat panel displays, PCBs, solar, and flexible electronics.
Key Features
- Large Sample Compatibility: Supports wafers and panels up to 350 mm in size
- Dual Camera Control: Top and side cameras for easy sample alignment and high spatial awareness
- Encoded 300 mm XY Stage: High-accuracy motorized scanning with 360° theta rotation
- Gage R&R Certified: Meets QA/QC requirements with repeatability under 5 Å
- Versatile Stylus Options: Replaceable stylus tips from 50 nm to 25 µm
- Vision64® Software: Seamless automation, analysis, and 3D visualization with hundreds of built-in tools
- Quick Analyzer + Step Detection: Simplified setup and focused reporting on complex samples
- Soft Touch Measurement: N-Lite low force technology ideal for delicate materials
- Comprehensive Data Logging: Recipe-based workflow with unique measurement IDs and database integration
Specifications
Specification | Details |
---|---|
Measurement Method | Stylus profilometry (contact) |
Surface Measurement Types | 2D profile, 3D mapping, step height, roughness |
Vertical Resolution | 1 Å max (@6.55 µm range) |
Step Height Repeatability | <5 Å (1σ on 0.1 µm step) |
Vertical Range | 1 mm |
Scan Length | Up to 300 mm |
Stylus Force Range | 0.03 mg to 15 mg |
Stylus Radius Options | 50 nm to 25 µm (custom available) |
XY Stage | Motorized, high-accuracy 300 mm stage |
R-Theta Stage | Motorized, continuous 360° rotation |
Cameras | Top-down (11.5 x 15.5 mm), Side view (2.5 x 4.25 mm) |
Software | Vision64® with optional pattern recognition & advanced automation |
Max Sample Size | 350 mm |
Max Sample Thickness | 50 mm |
Scan Data Points | Up to 120,000 per scan |
Vibration Isolation | Passive pneumatic isolation |
Operating Temperature | 20°C to 25°C (68°F to 77°F) |
Input Power | 100–240 VAC, 50–60 Hz |
System Dimensions (W × D × H) | 978 × 954 × 1714 mm |
System Weight | 272 kg (600 lbs) |
Compliance | CE, NRTL, SEMI S2, SEMI S8 certified |
Applications
Semiconductors
- Step height and etch depth monitoring
- CMP analysis (dishing, erosion, bow)
- Thin film deposition validation
Flat Panel Displays
- OLED and LCD layer analysis
- R&D of transparent conductive films
- Step height of barrier and active layers
Printed Circuit Boards
- Copper bump profiling
- Pad and trace height validation
- Surface finish inspection
Solar & Photovoltaics
- Film thickness mapping
- Trace height measurement on flexible and rigid substrates
- Uniformity checks across large glass panels
Flexible & Printed Electronics
- Organic film profiling
- Touch screen copper trace height measurement
- Substrate flatness and defect detection
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