Dektak XTL – High-Throughput Stylus Profiler

Dektak Pro Stylus Profiler

Product Overview

The Dektak XTL™ is a next-generation stylus profiler optimized for large-format samples up to 350 mm, delivering industry-leading repeatability, precision, and ease of use for production-floor metrology. Designed with dual-camera control, a high-accuracy encoded XY stage, and Bruker’s Vision64® software, the Dektak XTL provides fast, gage-capable measurements of step height, thin film thickness, surface roughness, and 3D profiles.

Its enclosed workstation, robust automation, and passive pneumatic isolation make it ideal for cleanroom and production-line use across sectors such as semiconductors, flat panel displays, PCBs, solar, and flexible electronics.

 

Key Features

  • Large Sample Compatibility: Supports wafers and panels up to 350 mm in size
  • Dual Camera Control: Top and side cameras for easy sample alignment and high spatial awareness
  • Encoded 300 mm XY Stage: High-accuracy motorized scanning with 360° theta rotation
  • Gage R&R Certified: Meets QA/QC requirements with repeatability under 5 Å
  • Versatile Stylus Options: Replaceable stylus tips from 50 nm to 25 µm
  • Vision64® Software: Seamless automation, analysis, and 3D visualization with hundreds of built-in tools
  • Quick Analyzer + Step Detection: Simplified setup and focused reporting on complex samples
  • Soft Touch Measurement: N-Lite low force technology ideal for delicate materials
  • Comprehensive Data Logging: Recipe-based workflow with unique measurement IDs and database integration

 

Specifications

Specification Details
Measurement Method Stylus profilometry (contact)
Surface Measurement Types 2D profile, 3D mapping, step height, roughness
Vertical Resolution 1 Å max (@6.55 µm range)
Step Height Repeatability <5 Å (1σ on 0.1 µm step)
Vertical Range 1 mm
Scan Length Up to 300 mm
Stylus Force Range 0.03 mg to 15 mg
Stylus Radius Options 50 nm to 25 µm (custom available)
XY Stage Motorized, high-accuracy 300 mm stage
R-Theta Stage Motorized, continuous 360° rotation
Cameras Top-down (11.5 x 15.5 mm), Side view (2.5 x 4.25 mm)
Software Vision64® with optional pattern recognition & advanced automation
Max Sample Size 350 mm
Max Sample Thickness 50 mm
Scan Data Points Up to 120,000 per scan
Vibration Isolation Passive pneumatic isolation
Operating Temperature 20°C to 25°C (68°F to 77°F)
Input Power 100–240 VAC, 50–60 Hz
System Dimensions (W × D × H) 978 × 954 × 1714 mm
System Weight 272 kg (600 lbs)
Compliance CE, NRTL, SEMI S2, SEMI S8 certified

 

 

Applications

Semiconductors

  • Step height and etch depth monitoring
  • CMP analysis (dishing, erosion, bow)
  • Thin film deposition validation

Flat Panel Displays

  • OLED and LCD layer analysis
  • R&D of transparent conductive films
  • Step height of barrier and active layers

Printed Circuit Boards

  • Copper bump profiling
  • Pad and trace height validation
  • Surface finish inspection

Solar & Photovoltaics

  • Film thickness mapping
  • Trace height measurement on flexible and rigid substrates
  • Uniformity checks across large glass panels

Flexible & Printed Electronics

  • Organic film profiling
  • Touch screen copper trace height measurement
  • Substrate flatness and defect detection

 

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