Dimension IconIR300

Product Overview

The Dimension IconIR300 is large-sample platform that unites industry-leading Atomic Force Microscopy (AFM) with photothermal AFM-IR spectroscopy, enabling chemical imaging and material property mapping on full 200 mm and 300 mm wafers. Engineered for advanced semiconductor R&D and production environments, IconIR300 provides unparalleled sensitivity, resolution, and automation for identifying and mapping organic and inorganic nano-contaminants, thin films, and polymeric materials.

Powered by Bruker’s patented Tapping AFM-IR and Surface-Sensitive AFM-IR technologies, this system delivers FTIR-correlated IR spectra with nanometer spatial resolution. Integrated with AutoMET software and KLARF file support, it offers comprehensive automated metrology for failure analysis, defect classification, and process monitoring across the semiconductor ecosystem.

Key Features

• Supports full 200 mm and 300 mm wafer access with non-destructive nanoscale spectroscopy
• Combines AFM-IR, chemical imaging, and PeakForce Tapping® property mapping in one system
• Provides high-resolution, surface-sensitive IR spectra directly correlated to FTIR libraries
• Tapping AFM-IR mode for artifact-free compositional and morphological imaging
• Real-time and offline automated recipe-based workflows with KLARF file compatibility
• AutoMET® software with optical and AFM image recognition, tip centering, and grid/wafer mapping
• Spatial resolution down to 4 nm with high sensitivity across organic/inorganic materials
• Ideal for identifying nanoscale contaminants and measuring step height on patterned wafers

Specifications

Applications

Semiconductors & Microelectronics

• Nanoscale chemical identification of organic and inorganic contaminants
• Photomask, bare wafer, and patterned wafer defect analysis
• IR-based classification of residues, polymers, and thin films
• Step height, trench depth, and material property measurement on dies

Advanced Packaging & Photonics

• Layer mapping and composition profiling of 3D stacks and interposers
• Surface-sensitive spectroscopy on thin coatings and dielectric films
• Correlative optical and mechanical inspection of nanoscale interconnects

Polymers & Lithography Materials

• Nanoscale compositional imaging of block copolymers and DSA patterns
• Identification of PMMA, PS, P4VP, and other photoresist materials
• Process validation of polymer cleaning, etching, and resist removal steps

Failure Analysis & Quality Control

• Automated location-based mapping using KLARF coordinates
• Spectral defect classification for root cause analysis
• Long-term statistical process control through recipe-based automation