High-Precision Digital Microscope for Industrial Inspection
Product Overview
The DSX1000 is an advanced, fully motorized digital microscope designed for high-precision imaging, measurement, and analysis in industries such as semiconductor, electronics, automotive, aerospace, and materials science.
Offering a wide magnification range from 27X to 9,637X, 6 observation modes, and a motorized tilting optical head, the DSX1000 ensures accurate, repeatable, and efficient inspections. Its telecentric optical system, high-resolution imaging, and AI-powered analysis tools make it an ideal solution for failure analysis, quality control, and research applications.
Key Features
- Wide Magnification Range – 27X to 9,637X for both macro and micro inspections.
- 6 Observation Methods – Brightfield, Darkfield, Oblique, MIX, Polarization, and DIC for versatile imaging.
- Telecentric Optical System – Ensures accurate, distortion-free measurements at all magnifications.
- Motorized Tilting & Rotation – ±90° oblique observation and 360° sample rotation for comprehensive analysis.
- Deep Depth of Field & Long Working Distance – Accommodates larger, uneven samples with up to 66 mm working distance.
- Ultra-High-Resolution Imaging – Utilizes a 2.35 MP color CMOS sensor with pixel-shift technology for enhanced clarity.
- AI-Powered Image Processing – TruAI software for real-time image enhancement and defect detection.
- PRECiV™ Software Integration – Automated 2D/3D measurements, stitching, and material analysis.
- Fast, Smooth Live Imaging – Global shutter and 60 fps frame rate ensure sharp real-time imaging.
- Easy One-Click Operation – Instantly switch lenses and observation modes for fast, efficient workflows.
Specifications
| Feature | Specification |
|---|---|
| Optical System | Telecentric Optical System |
| Magnification Range | 27X – 9,637X |
| Observation Methods | Brightfield, Darkfield, Oblique, MIX, Polarization, DIC |
| Camera Sensor | 2.35 MP Color CMOS, Global Shutter |
| Resolution Modes | Up to 5760 × 3600 (Pixel Shift Mode) |
| Frame Rate | 60 fps (Full HD Live Imaging) |
| Working Distance | Up to 66 mm |
| Focus Mechanism | Motorized, 101 mm Stroke |
| Motorized Tilting & Rotation | ±90° Oblique, 360° Rotational Stage |
| Stage Options | Motorized (100 × 100 mm, 200 × 100 mm), Manual (100 × 105 mm) |
| 3D Measurement Capabilities | Yes (Surface Profiling, Step Height, Volume Analysis) |
| Software Integration | PRECiV™ with Automated 2D/3D Analysis & AI Processing |
| Display Compatibility | 27-inch 4K Monitor |
| Network Connectivity | Windows 11, Secure IT Compliance |
| Power Supply | 100–240V, 50/60Hz |
| Weight | 43.7 kg (Upright Frame), 46.7 kg (Tilt Frame) |
Applications
- Wafer & MEMS Inspection – Analyze microfabrication defects, layer inconsistencies, and contamination.
- PCB & Solder Joint Analysis – Detect fine cracks, solder defects, and component misalignment.
- Microelectronics Quality Control – Non-destructive analysis of circuit boards and conductive pathways.
- Material & Surface Analysis – Evaluate wear patterns, coatings, and corrosion resistance.
- Component Failure Analysis – Detect stress fractures, microcracks, and material fatigue.
- Weld & Bond Strength Testing – Assess weld seams and structural joints for quality assurance.
- Implant & Prosthetic Inspection – Measure surface roughness and cleanliness of medical devices.
- Micro-Machined Parts Analysis – Ensure precision in small mechanical and optical components.
- 3D Printed & Coated Material Evaluation – Assess thickness, adhesion, and surface uniformity.
Resources
Talk to us
Please complete the form and we will be in contact as soon as possible.