Extended-Range In-Situ SEM PicoIndenter

Bruker Hysitron PI 85E

Product Overview

The Hysitron® PI 85E SEM PicoIndenter is a versatile in-situ nanomechanical testing instrument engineered to deliver quantitative nanomechanical property measurements within the high-resolution imaging environment of a scanning electron microscope (SEM). Designed with an extended force and displacement range, the PI 85E bridges the gap between nanoscale and microscale mechanical testing—ideal for a wide spectrum of materials including metals, ceramics, composites, and semiconductors.

With real-time imaging and data synchronization, the PI 85E provides researchers with unparalleled insight into material behavior such as deformation, fracture, fatigue, and creep. The system’s compact design, broad material applicability, and range of test modes make it suitable for small SEM chambers, optical/Raman microscopes, and beamlines alike.

 

Key Features

  • Extended mechanical range: Up to 250 mN load and 100 µm displacement
  • Multiple testing modes: Indentation, compression, tension, bending, fatigue, and nanoDynamic™
  • Low noise floors: Exceptional sensitivity and accuracy for small-scale testing
  • Compact footprint: Mounts directly on SEM stages, preserving tilt and working distance
  • In-situ imaging compatibility: Real-time correlation of deformation behavior and test data
  • Flexible control modes: Closed-loop load/displacement and open-loop configurations
  • Supports interchangeable probes with various geometries for diverse test types
  • Advanced software: Bruker’s Tribo iQ™ for comprehensive data visualization and analysis

 

Specifications

Specification Details
Maximum Load Capacity 250 mN (Extended range), 10 mN (Standard)
Displacement Range Up to 100 µm (Extended), 5 µm (Standard)
Force Control Modes Closed-loop force, closed-loop displacement, open-loop load
Transducer Technology Capacitive-based high-bandwidth actuator and flexure
Noise Floor (Force) Sub-microNewton range (10 mN), low microNewton (250 mN)
Noise Floor (Displacement) <1 nm (SEM environment), <0.1 nm (ideal environment)
Sample Size Support Up to 20 mm thick
Positioning Accuracy XYZ travel >3 mm in all directions
Control Electronics Advanced high-speed data acquisition and feedback
Analysis Software Tribo iQ™ for mechanical property modeling and mapping
Microscope Compatibility SEM, FIB/SEM, PFIB, optical and Raman systems
Mounting & Integration Compact, low-profile for direct SEM stage mounting

 

 

Applications

Semiconductor & Electronics

  • Thin film and device-level mechanical testing
  • Stress-strain analysis on interconnects and low-k materials
  • Phase-change and piezoelectric material testing under load

Nanotechnology & MEMS

  • Nano-scale pull/push-to-pull tensile testing of nanowires and films
  • MEMS structure mechanical verification and stress testing
  • In-situ feedback for MEMS fabrication and optimization
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