Extended-Range In-Situ SEM PicoIndenter
Product Overview
The Hysitron® PI 89 SEM PicoIndenter is a powerful, modular in-situ nanomechanical test instrument designed for use within scanning electron microscopes (SEM or FIB/SEM). Leveraging Bruker’s industry-leading capacitive transducer technology, the PI 89 enables real-time mechanical testing with high spatial resolution under SEM imaging conditions.
Its compact, high-stiffness design allows for seamless integration into SEM systems without compromising imaging capabilities. The PI 89 supports a wide range of test types—nanoindentation, compression, tension, bending, fatigue, and wear—with options for high-temperature, cryogenic, electrical, and XPM accelerated property mapping modes. The PI 89 Auto variant further enhances productivity through automation and seamless imaging integration.
Key Features
- Wide Force and Displacement Range: Transducer options up to 3.5 N force and 150 µm displacement
- In-Situ Testing Compatibility: Real-time observation of deformation, fracture, fatigue, and phase transformations
- Modular & Upgradeable: Supports high-temp (up to 1000°C), cryo (< -130°C), electrical, and fatigue testing
- Exclusive Bruker Transducers: Load and displacement-controlled tests with low noise and high accuracy
- SEM/FIB Ready: Minimal footprint, low working distance, and full stage tilt compatibility
- Rotational/Tilt Stage: Optional 5-axis stage for EBSD, TKD, and co-localized imaging integration
- High-Speed Data Acquisition: Up to 39 kHz with 78 kHz feedback rate using Performech® II controller
- Push-to-Pull and Direct Pull Testing: For tensile property measurements of nanowires, films, and micro-pillars
- XPM Accelerated Property Mapping: Up to one indentation per second for rapid modulus/hardness maps
Specifications
| Specification | Details |
|---|---|
| Max Force (Transducer Options) | 10 mN, 0.5 N, >3.5 N |
| Force Noise Floor (In SEM) | <0.4 μN (10 mN), <5 μN (0.5 N), 30 μN (3.5 N) |
| Force Noise Floor (Ideal Env.) | <50 nN (10 mN transducer) |
| Max Displacement | 5 µm, 30 µm, 150 µm |
| Displacement Noise (SEM) | <1 nm |
| Displacement Noise (Ideal Env.) | <0.1 nm (10 mN transducer) |
| Machine Stiffness | 0.9 × 10⁶ N/m |
| Positioning Range (XYZ) | 12 mm × 26 mm × 29 mm; 1 nm encoded resolution |
| System Size (WxHxL) | 68 × 42 × 191 mm |
| System Weight | 550 g |
| Rotation/Tilt Stage | 5 Degrees of Freedom (PI 89 Auto) |
| XPM Mapping Capability | Automated large area maps >1 mm², 1 test/sec |
| Optional Testing Modes | Nanoindentation, fatigue, wear, SPM, nanoScratch, nanoDMA, electrical |
| Temperature Range | Cryo < -130°C to 1000°C (with environmental stages) |
| SEM Compatibility | SEM, FIB/SEM, TKD, STEM compatible |
Applications
Semiconductor & Electronics
- Mechanical property analysis of ultra-thin films, interconnects, and packaging materials
- Real-time deformation of advanced microstructures under vacuum and imaging conditions
- Co-localized EBSD/mechanical property mapping for process monitoring
Materials Science & Metallurgy
- Pillar compression and fracture studies
- Accelerated hardness/mapping of multiphase materials
- Fatigue, creep, and stress–strain analysis in 3D printed metals and ceramics
Nanotechnology & MEMS
- In-situ performance of MEMS actuators and sensors under stress
- Tensile tests on nanowires, films, and microbeams using push-to-pull devices
- Ultra-low force precision testing for sub-micron structures
Resources
Please complete the form and we will be in contact as soon as possible.