In-Situ TEM PicoIndenter for Direct-Observation Nanomechanical Testing
Product Overview
The Hysitron® PI 95 TEM PicoIndenter is the first full-fledged depth-sensing indenter designed for direct-observation nanomechanical testing within a Transmission Electron Microscope (TEM). This side-entry instrument enables simultaneous imaging of nanoscale material responses and acquisition of quantitative load-displacement data. An integrated video interface synchronizes mechanical measurements with corresponding TEM video, providing unparalleled insights into material behavior at the nanoscale .
Key Features
- In-Situ Nanomechanical Testing: Perform indentation, compression, tension, bending, and scratch tests directly inside the TEM.
- High-Frequency Data Acquisition: The Performech® control module offers a 78 kHz feedback rate and up to 38 kHz data acquisition to capture transient events like dislocation bursts .
- Precise Tip Positioning: Combines a three-axis coarse positioner, 3D piezoelectric actuator, and an advanced transducer for electrostatic actuation and capacitive displacement sensing .
- Versatile Compatibility: Designed for seamless integration with major TEM models, including JEOL, FEI, Hitachi, and Zeiss .
- Customizable Testing Modes: Supports Push-to-Pull (PTP), Electrical Push-to-Pull (EPTP), nanoDynamic, high-temperature, and electrical characterization .
Specifications
| Specification | Details |
|---|---|
| Maximum Load | 1.5 mN |
| Maximum Displacement | 5 µm |
| Force Sensitivity | <200 nN |
| Displacement Sensitivity | <1 nm |
| Tip Positioning | Three-axis coarse positioner, 3D piezoelectric actuator, electrostatic transducer |
| Data Acquisition Rate | Up to 38 kHz |
| Feedback Rate | 78 kHz |
| Compatible TEM Models | JEOL, FEI, Hitachi, Zeiss |
| Testing Modes | Indentation, compression, tension, bending, scratch, nanoDynamic |
| Upgrade Options | High-temperature module, electrical characterization, nanoScratch module |
Applications
Materials Science & Metallurgy
- Real-time observation of dislocation nucleation and motion, deformation twinning, phase transformations, and fracture at the nanoscale.
- Quantitative analysis of mechanical properties of metals, ceramics, and composites under various loading conditions.
Semiconductors & Electronics
- Evaluation of mechanical behavior of thin films, interconnects, and other microelectronic components.
- Investigation of failure mechanisms in semiconductor devices under mechanical stress.
Nanotechnology & MEMS/NEMS
- Characterization of mechanical properties of nanowires, nanotubes, and other nanostructures.
- In-situ testing of MEMS/NEMS devices to assess performance and reliability.
Energy & Battery Research
- Study of mechanical degradation in battery materials during charge/discharge cycles.
- Analysis of structural changes in energy storage materials under mechanical loading.
Resources
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