UMT TriboLab Tribometers and Mechanical Testers

Hysitron TI 990

Product Overview

The Hysitron TI 990 TriboIndenter is the most advanced nanomechanical test system, offering unmatched precision, speed, and versatility for nanoindentation, nanoscratch, nanowear, and high-speed mechanical property mapping.

Equipped with Performech® III control technology, nanoDMA® IV dynamic indentation, and XPM™ II accelerated property mapping, the TI 990 enables quantitative mechanical characterization of semiconductors, thin films, polymers, biomaterials, and advanced composites. Its modular architecture ensures seamless integration of future techniques, making it a long-term solution for cutting-edge research and industrial applications.

 

Key Features

  • Industry-Leading Sensitivity – Achieves sub-nanometer resolution with electrostatic actuation technology.
  • Ultra-Fast Data AcquisitionXPM™ II technology enables 12 property measurements per second.
  • Dynamic NanoindentationnanoDMA® IV provides viscoelastic and time-dependent property analysis.
  • In-Situ SPM Imaging±10 nm positioning accuracy for precise nanomechanical testing.
  • Advanced TriboScan™ 12 SoftwareIntuitive workflow, automated test scripting, and real-time data acquisition.
  • Vibration & Noise IsolationGranite platform, environmental enclosure, and active vibration isolation for stability.
  • Modular & Scalable – Compatible with multiple testing techniques including electrochemical, Raman spectroscopy, and modulus mapping.

 

Specifications

Feature Specification
Measurement Techniques Nanoindentation, Nanoscratch, Nanowear, SPM Imaging, XPM™ II Property Mapping
Force Range 1 µN to 10 N
Displacement Resolution Sub-nanometer precision>
Scanning Probe Microscopy (SPM) ±10 nm test positioning accuracy
XPM™ II High-Speed Mapping 12 mechanical property measurements per second
Software Interface TriboScan™ 12 & Tribo iQ™ analysis suite
Environmental Isolation Integrated vibration and noise isolation system
Multi-Sample Testing Automated sample positioning & large-area testing
Operating Temperature Ambient to 800°C (with xSol® stage upgrade)
Sample Compatibility Magnetic, mechanical, and vacuum chuck mounting options
Power Requirements 100-240V AC, 50/60Hz
System Dimensions Compact modular design with customizable enclosure

 

 

Applications

 

  • Semiconductor & MicroelectronicsThin film hardness, wafer mechanical properties, MEMS reliability testing.
  • Coatings & Hard MaterialsNanoscratch, adhesion, and wear resistance analysis.
  • Polymers & Soft MaterialsElastic-plastic deformation, viscoelastic property measurement, and time-dependent creep testing.
  • Biomaterials & Life SciencesNanomechanical characterization of implants, tissues, and biomolecules.
  • Energy & Advanced MaterialsBattery electrodes, nanocomposites, and structural material testing.
  • Automotive & AerospaceWear resistance, lubrication performance, and tribological studies.

 

 

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