Versatile Nanoindenter for Advanced Nanomechanical Testing
Product Overview
The Hysitron TI Premier II is a powerful and flexible nanoindenter designed to meet the evolving needs of nanomechanical research and material testing. Built on Bruker’s industry-proven capacitive transducer technology, the system offers high-precision measurement of mechanical properties from the nano- to microscale.
Featuring modular expandability, the TI Premier II supports an extensive array of testing techniques including hardness, modulus, creep, fracture toughness, wear, and in-situ imaging. Its streamlined operation is enhanced by TriboScan™ 12 software, automated workflows, and a universal sample stage that accommodates a wide variety of materials and geometries.
Ideal for academic and industrial researchers, the TI Premier II offers a future-proof platform with optional environmental controls for temperature, humidity, electrochemistry, and cryogenic conditions.
Key Features
- High-sensitivity capacitive transducer for sub-nanometer displacement and low-force measurement
- Modular platform with a wide range of nanomechanical and tribological test modes
- Integrated in-situ scanning probe microscopy (SPM) for accurate test placement and deformation imaging
- XPM (accelerated property mapping) for fast, high-resolution mechanical property mapping
- Universal sample stage supports magnetic, mechanical, and vacuum chucks
- Automated, customizable routines with TriboScan™ 12 control software
- Powerful Tribo iQ™ data analysis tools with over 15 technique-specific modules
- Compatible with advanced modules for high-temp, cryo, humidity, and electrochemical testing
Specifications
| Specification | Details |
|---|---|
| Force Range (Standard) | Up to 10 mN |
| Displacement Resolution | Sub-nanometer |
| Force Resolution | Nano-Newton level |
| Test Modes | Nanoindentation, nanoscratch, nanoDMA®, modulus mapping, wear, fracture |
| In-Situ Imaging | Integrated SPM with user-settable force control |
| Accelerated Mapping | XPM (Quantitative mechanical mapping in minutes) |
| Stage Capabilities | Universal mounting: magnetic, mechanical, and vacuum-compatible |
| Control Software | TriboScan™ 12 with pre-programmed and customizable tests |
| Data Analysis Software | Tribo iQ™ with technique-specific explorers and clustering tools |
| Automation | Full support for scripting, batch testing, and auto-alignment |
| Environmental Options | High-temp (up to 800°C), cryo (-120°C), humidity (5–75% RH), inert gas |
| Optional Force Transducers | Extended force up to 10 N and 80 µm displacement |
| Additional Capabilities | nanoECR® (electrical), xSol® stages, acoustic emission (TriboAE™), xProbe |
Applications
Materials Science & Engineering
- Elastic modulus, hardness, and fracture toughness of metals, ceramics, and polymers
- In-depth creep and stress relaxation analysis
- Strain rate sensitivity in time-dependent materials
Semiconductor & Microelectronics
- Mechanical property evaluation of ultra-thin films, low-k dielectrics, and interconnects
- Thin film adhesion and wear analysis using nanoscratch and friction modes
- Electrical-mechanical coupling using in-situ conductive indentation (nanoECR®)
Energy & Battery Research
- Mechanical testing of solid electrolytes and electrode materials
- Thermal and humidity effects on ionic conductors and composites
- Electrochemical wear and tribological behavior under load
Advanced Coatings & Tribology
- Adhesion and wear resistance testing of functional coatings
- Mapping heterogeneity in multi-layer films
- Real-time monitoring of crack propagation and deformation (TriboAE™)
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