iineo+ – Advanced SMT Pick and Place Solution
Product Overview
The iineo+ is a state-of-the-art Surface Mount Technology (SMT) pick and place machine designed to deliver exceptional flexibility, high feeder capacity, and superior placement accuracy. Engineered to handle a wide range of components and PCB sizes, the iineo+ is ideal for diverse manufacturing requirements, from small batches to high-volume production. Its modular design allows for easy configuration without compromising on performance, making it a versatile solution for modern electronics assembly.
Key Features
- High Feeder Capacity: Accommodates up to 264 x 8mm tape feeders, reducing the need for frequent feeder changes and enabling efficient handling of complex assemblies.
- Versatile Component Handling: Capable of placing components ranging from 01005 chips to 99mm x 99mm parts, with a maximum component height of 34mm and weight up to 300g.
- Flexible PCB Support: Supports PCB sizes from 60mm x 60mm up to 1610mm x 460mm, catering to a broad spectrum of board dimensions.
- Advanced Placement Heads: Equipped with rotary turret heads featuring 8 or 12 placement nozzles, each capable of handling the full range of components for optimal line balancing.
- Integrated Component Testing: Features built-in component testing capabilities with independently verifiable calibration standards (e.g., UKAS, NIST, PTB), ensuring high-quality placements.
- Optional Dispensing System: Offers Archemedes or air/time dispensing options for precise application of glue or solder paste.
- Intelligent Software Integration: Incorporates an intuitive touch-screen user interface and advanced software tools for streamlined operation and real-time monitoring.
Specifications
| Feature | Specification |
|---|---|
| Placement Rate | Up to 30,000 components per hour (cph) |
| Placement Accuracy | 35µm (QFPs) to 60µm (chips) @ 3 sigma |
| Feeder Capacity | 264 x 8mm tape feeders |
| PCB Size Range | Minimum: 60mm x 60mm Maximum: 1610mm x 460mm |
| Component Size Range | 01005 to 99mm x 99mm |
| Component Height | Up to 34mm |
| Component Weight | Up to 300g |
| Nozzle Positions | 8 or 12 per turret head |
| Component Testing | Integrated with verifiable calibration standards |
| Dispensing Options | Archemedes or air/time for glue or solder paste |
| User Interface | Intuitive touch-screen with advanced software tools |
| Board Thickness | 0.5mm to 10.0mm |
| Board Weight | Up to 3kg (standard), up to 10kg (optional) |
| Under Board Clearance | 25mm |
| Board Edge Clearance | 3mm above / 5mm below |
| Transport Direction | Left to Right (Right to Left optional) |
| Transport Height | Adjustable between 890mm to 975mm |
| SMEMA Interface | Standard |
Applications
- Consumer Electronics: Efficient assembly of smartphones, tablets, and wearable devices with diverse component requirements.
- Automotive Electronics: Production of reliable automotive control units, sensors, and infotainment systems.
- Industrial Equipment: Manufacturing of control systems, power supplies, and industrial automation components.
- Medical Devices: Assembly of compact and complex medical electronics requiring precise placement.
- Aerospace & Defense: Production of high-reliability electronic modules for avionics and defense applications.
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