Advanced Automated AFM Metrology System
Product Overview
The InSight AFP by Bruker is a fifth-generation, high-performance atomic force profiler designed for advanced semiconductor manufacturing. It offers unparalleled resolution, rapid profiling speeds, and long-term measurement stability, making it ideal for critical process control in CMP profiling and etch depth metrology.
Key Features
- Exceptional Resolution and Stability: Achieves 0.3 nm long-term stability with NIST-traceable reference metrology, ensuring consistent accuracy over extended periods.
- High Throughput: Capable of measuring 260–340 sites per hour, supporting up to 50 wafers per hour throughput for inline applications.
- Rapid Profiling: Offers profiling speeds up to 36,000 µm/sec, enabling high-resolution 3D characterization and hotspot identification.
- Advanced Imaging Modes:
- TrueSense® Technology: Provides high-resolution imaging with extended tip life.
- CDMode: Characterizes sidewall features and roughness, reducing the need for cross-sectioning.
- DTMode: Delivers low Total Measurement Uncertainty (TMU) for depth metrology with <10 s MAM time.
- Automated Defect Review: Integrates with KLARITY and other YMS systems, offering less than ±250 nm raw image placement accuracy for patterned wafers and masks.
- 3D Die Mapping: Utilizes HyperMap™ for rapid, full 3D post-CMP characterization and inspection of standard reticle fields.
Specifications
| Specification | Details |
|---|---|
| Long-Term Stability | 0.3 nm |
| Throughput | 260–340 sites/hour; up to 50 wafers/hour |
| Profiling Speed | Up to 36,000 µm/sec |
| Imaging Modes | TrueSense®, CDMode, DTMode |
| Integration | Compatible with KLARITY and most YMS systems |
| 3D Mapping Capability | HyperMap™ for full reticle field scanning |
Applications
- CMP Advanced Process Control: Ensures accurate, precise, and reproducible measurements for front, mid, back, and far-back end-of-line polishing processes.
- Etch Advanced Process Control: Provides reliable depth metrology with low TMU, essential for high-volume manufacturing etch process control.
- Etch Process Development: Facilitates flexible and accurate metrology for process development, accommodating short loops and complex DOEs.
- CMP Process Development: Supports rapid and precise metrology for CMP process development, handling topographies from tens of nanometers to 300 mm.
- EUV Process Monitoring: Utilizes TrueSense™ mode for non-destructive top-line roughness measurements, aiding in EUV resist development and monitoring.
Resources
Talk to us
Please complete the form and we will be in contact as soon as possible.