Magna UHR Scanning Electron Microscope

Product Overview

The MAGNA SEM is a state-of-the-art Ultra-High-Resolution (UHR) Scanning Electron Microscope (SEM), designed for next-generation material characterization at the nanoscale. Featuring the Triglav™ electron column with TriLens™ immersion optics, the MAGNA SEM delivers exceptional resolution, contrast, and selective signal acquisition, making it ideal for nanoparticle research, catalysis, battery materials, semiconductors, and life sciences.

With TriBE™ and TriSE™ in-beam detection technology, high-throughput microanalysis, and an integrated STEM mode, MAGNA provides unparalleled imaging performance for researchers and engineers working on advanced nanomaterials and ultra-thin specimens.

Key Features

• Ultra-High-Resolution (UHR) Imaging – Achieves 0.6 nm resolution at 15 keV, optimized for low-voltage applications.
• TriLens™ Immersion Optics – Ensures maximum resolution and contrast for materials with delicate structures.
• TriBE™ & TriSE™ Detection System – Selectable backscattered (BSE) and secondary electron (SE) contrast modes.
• High Electron Beam Current (up to 400 nA) – Supports extended acquisition times for EDX, WDS, and EBSD microanalysis.
• In-Flight Beam Tracing™ – Optimizes beam conditions for high-resolution imaging and analytical precision.
• Energy-Filtered BSE Detection – Provides enhanced material contrast from the shallowest sample layers.
• STEM Mode for Transmission Imaging – Integrated scanning transmission electron microscopy (STEM) detector for thin-sample analysis.
• Beam Deceleration Mode (BDM) – Minimizes charging effects and improves low-kV resolution (0.9 nm at 1 keV).
• Automated Image Stitching & Large-Scale Mosaics – Ideal for biological tissue and nanomaterial studies.
• TESCAN Essence™ User Interface – Customizable software platform with workflow automation and analytical tools.

Specifications

Applications

• Characterization of Catalysts & Nanoparticles – Observe shape, size, and distribution at high resolution.
• Battery & Energy Storage Materials – Study electrode structures and degradation at the nanoscale.
• Carbon Nanotubes & 2D Materials – Analyze graphene, nanotubes, and other low-dimensional materials.
• Failure Analysis & Quality Control – Identify microcracks, porosity, and contaminants in metal components.
• Additive Manufacturing & Coating Inspection – Assess surface uniformity and adhesion strength.
• Microstructure & Phase Distribution Studies – Examine grain boundaries and phase compositions.
• IC, MEMS & PCB Inspection – Detect structural defects, layer inconsistencies, and material contaminants.
• Thin Film & Device Analysis – Characterize film thickness and interface quality in advanced electronics.
• STEM Imaging of Nanostructures – Visualize internal features of microelectronic components.
• Brain Tissue & Neural Network Studies – Observe ultrastructural details in resin-embedded samples.
• Biomaterials & Implants Research – Analyze cell-material interactions and surface modifications.
• Soft Material Imaging with Low-kV BSE – Preserve fine structural details with minimal sample charging.
• Mineral & Rock Sample Characterization – Study composition, porosity, and crystallographic details.
• Petrographic & Pore Network Imaging – Assess fluid pathways in sedimentary formations.
• Environmental Nanoparticle Analysis – Detect airborne particles and pollution-related nanomaterials.