High-Resolution Analytical SEM for Sub-Micron Materials Characterisation
Product Overview
The MIRA SEM is a 4th generation Scanning Electron Microscope (SEM) equipped with a Field Emission Gun (FEG) Schottky electron source, designed for high-resolution imaging and comprehensive materials analysis at the sub-micron scale. Integrating SEM imaging and live elemental composition analysis within TESCAN’s Essence™ software, MIRA streamlines the acquisition of both morphological and elemental data, making it an efficient solution for routine materials inspection, quality control, failure analysis, and research laboratories.
Key Features
- Integrated Essence™ EDS: Combines SEM imaging with elemental composition analysis in a single software window for efficient workflows.
- Apertureless Optical Design: Powered by In-Flight Beam Tracing™, ensuring optimal imaging and analytical conditions without mechanical realignment.
- Wide Field Optics™: Allows navigation at magnifications as low as 2× without an additional optical camera, facilitating seamless sample overview.
- SingleVac™ Mode: Standard feature enabling observation of charging and beam-sensitive samples.
- Modular Essence™ Software: User-friendly interface designed for effortless operation, accommodating various user experience levels.
- 3D Collision Model: Ensures safety of chamber-mounted detectors during stage and sample movements.
- Optional In-Column Detectors: Availability of in-column SE and BSE detectors, including Beam Deceleration Technology for enhanced low-voltage imaging performance.
- Modular Analytical Platform: Expandable with a wide selection of fully integrated detectors, such as CL, water-cooled BSE, or Raman spectrometer, to suit diverse analytical needs.
Specifications
| Feature | Specification |
|---|---|
| Electron Source | FEG Schottky emitter |
| Resolution | 1.2 nm at 30 keV |
| Accelerating Voltage | 0–30 kV |
| Magnification Range | 2× to 1,000,000× |
| Imaging Modes | Secondary Electron (SE), Backscattered Electron (BSE), Energy-Dispersive X-ray Spectroscopy (EDS) |
| Vacuum Modes | High Vacuum, SingleVac™ |
| Stage | Fully motorized 5-axis compucentric stage; accommodates specimens up to 4-inch diameter |
| Detectors | Everhart-Thornley SE detector, In-column SE and BSE detectors (optional), EDS detector |
| Software | TESCAN Essence™ with integrated EDS, 3D Collision Model, and customizable workflows |
| Beam Deceleration | Available with optional Beam Deceleration Technology for enhanced low-voltage imaging |
Applications
- Microstructural Analysis: Examine grain structures, phase distributions, and inclusions in metals and alloys.
- Failure Analysis: Identify fractures, voids, and other defects in materials to determine failure mechanisms.
- Coatings and Surface Treatments: Assess thickness, uniformity, and adhesion of coatings on various substrates.
- Device Inspection: Analyze integrated circuits, MEMS devices, and other semiconductor components for defects and quality assurance.
- Thin Film Analysis: Characterize thin film materials used in electronic devices for uniformity and composition.
- Nanofabrication: Investigate nanostructures and patterns essential for advanced electronic applications.
- Cellular Imaging: Observe cell morphology, interactions, and ultrastructural details at high resolution.
- Biomaterials Research: Characterise scaffolds, implants, and other biomaterials to evaluate biocompatibility and structural integrity.
- Pathological Studies: Examine tissue samples for disease diagnosis and research.
- Mineral Identification: Determine mineral compositions and structures in geological samples.
- Petrography: Study rock textures and compositions to understand geological history and processes.
- Paleontology: Investigate fossilised remains at the microstructural level.
Resources
Talk to us
Please complete the form and we will be in contact as soon as possible.