SOLARIS Focused Ion Beam - Scanning Electron Microscope

Product Overview

The SOLARIS is an advanced Focused Ion Beam - Scanning Electron Microscope (FIB-SEM) system designed for high-throughput, precise semiconductor failure analysis and defect review. Engineered for sub-10 nm technology nodes, SOLARIS features high-resolution Triglav™ SEM imaging, fully automated TEM lamella preparation, and precise nanomachining for IC repair.

With its high-current ion column, OptiLift™ nanomanipulator, and TESCAN TEM AutoPrep™ Pro, SOLARIS enables fast, automated TEM sample preparation, ensuring repeatable, high-quality lamellae for transmission electron microscopy (TEM). Its AI-driven fiducial mark recognition and precision end-pointing make it the ideal solution for advanced semiconductor process development, packaging analysis, and failure diagnostics.

Key Features

• High-Throughput TEM Lamella Preparation – Automated workflows reduce sample preparation time for TEM analysis.
• Triglav™ High-Resolution SEM Column – Optimized for ultra-high-resolution imaging of advanced semiconductor nodes.
• AI-Powered Fiducial Mark Recognition – Ensures precise targeting of FinFET, GAA, and memory structures.
• OptiLift™ Nanomanipulator – Provides accurate, automated lift-out and handling of lamella samples.
• Customizable TESCAN TEM AutoPrep™ Pro – User-friendly workflow automation for fast, reliable TEM sample prep.
• Large FIB Current for High-Speed Milling – Efficient material removal for cross-sectioning and circuit modification.
• Automated End-Point Detection – Ensures sample accuracy with beam coincident imaging.
• Integrated STEM Detector (Optional) – Enhances contrast in sub-surface imaging.

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Specifications

Applications

• IC Defect Localization & Cross-Sectioning – Accurate end-pointing and imaging of sub-10 nm nodes.
• Delayering & Circuit Edit – Precision ion milling for device debugging and modification.
• TEM Sample Preparation – Automated workflows for consistent, ultra-thin TEM lamellae.
• Flip-Chip & Wafer-Level Packaging Inspection – Analyze TSVs, solder bumps, and wire bonding integrity.
• Failure Analysis in Advanced Nodes – Examine defects in DRAM, NAND, and logic chips.
• FIB-SEM for Heterogeneous Integration – High-precision sectioning for complex semiconductor structures.
• Thin Film & Coating Studies – Analyze interface layers and deposition quality.
• Sub-Surface Imaging with STEM – Enhance material contrast for advanced material characterization.
• Lithography & Pattern Inspection – Ensure critical dimension accuracy and defect detection.