Scalable Imaging from 2D to Dynamic CT for Power Electronics, Batteries, and Assemblies
Product Overview
The X# Series is a versatile, modular inline AXI platform designed for advanced inspection of power electronics, automotive components, batteries, and high-density circuit assemblies. With a choice of imaging capabilities—including 2D Transmission, 2.5D Off-Axis, and 3D SART & Dynamic Planar CT—the X# Series adapts to your production requirements while maintaining ultra-high accuracy and throughput.
Its Ultra-High Power setup (180 kV / 90 W) ensures deep penetration of dense materials like IGBT modules, cooling plates, and battery layers, while the advanced MIPS 5 software suite offers intelligent defect detection, simulation, offline programming, and full Industry 4.0 connectivity.
Key Features
- Modular system with 2D, 2.5D, and 3D CT (SART & Planar) configurations
- 180 kV sealed X-ray source for high-penetration applications
- CMOS flat-panel detector with 125 µm resolution (4 MP)
- Slice-Filter-Technique™ (SFT) and Simultaneous Algebraic Reconstruction Technique (SART)
- Up to 5 programmable axes for comprehensive inspection angles (up to 25°)
- AI-powered Automatic Tree Classification (ATC) for defect learning and classification
- Flexible in-line and island configuration (pass-through, same-side I/O)
- Full MES/SECS/GEM/IPC-Hermes/IPC-CFX integration for traceability
- MIPS 5 software with offline simulation, SPC, defect catalog, and CAD import
- Barcode scanner, automatic grey-level calibration, and multi-mode motion system
Specifications
| Feature | Specification |
|---|---|
| Inspection Modes | X2#: 2D + SFT™, X2.5#: 2D + SFT™ + 2.5D, X3#: Full + 3D SART + CT |
| X-ray Source | 180 kV / 90 W (sealed, microfocus, maintenance-free) |
| Detector Type | CMOS flat-panel, 125 µm pixel, 4 MP |
| Inspection Speed (2D) | Up to 3–4 views/sec |
| 3D SART / Planar CT Speed | 3 s/FoV (SART), up to 8 s/ROI (Planar CT) |
| Inspection Resolution | Down to 6 µm / pixel |
| Max Sample Size | 510 × 400 mm |
| Min Sample Size | 100 × 80 mm |
| Max Sample Thickness | 10 mm |
| Max Sample Weight | 10 kg |
| Assembly Clearance | Top: 100 mm (incl. sample), Bottom: 40 mm (excl. sample) |
| Motion Axes | X, Y (table), Z (magnification), U, V (detector motion) |
| Conveyor Configuration | Pass-through (single-lane), same-side I/O, island |
| System Dimensions (H × W × D) | 1775 × 3100 × 1760 mm |
| Weight | 2800 kg |
| Power Requirement | 400 VAC / 208 VAC, 3-phase, up to 6 kW |
| Air Requirement | 5–7 bar, <2 L/min, dry and filtered |
| Operating Temperature | 15–28°C (optimal 20–25°C) |
| Software Platform | MIPS 5 with SPC, CAD import, offline programming |
| Connectivity | SECS/GEM, IPC-CFX, IPC-Hermes, MES-ready |
Applications
Power Electronics
- Voiding detection in die attach and solder layers of IGBT modules
- Cooling plate and heatsink inspection with deep X-ray penetration
- Solder joint quality assurance in power inverters and converters
Semiconductors & Advanced Packaging
- High-resolution imaging of stacked die, flip chips, and multi-layer packages
- Warpage compensation and multi-angle imaging for BGA/QFN/PoP
- Suitable for low-voiding high-density substrates
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