Advanced 2D, 2.5D, and 3D X-ray Imaging for SMT, THT, and Complex Assemblies
Product Overview
The X Series delivers powerful, modular Automated X-ray Inspection (AXI) for high-throughput SMT production and complex PCB assemblies. Designed for inline operation, it supports inspection of single/multipanels or trays using a combination of 2D transmission imaging, Off-Axis (2.5D) views, and 3D imaging technologies like SART (Simultaneous Algebraic Reconstruction Technique) and Dynamic Planar CT.
Available in X2.5 and X3 configurations, the X Series provides full coverage of solder joints, PTH components, and power electronics with ultra-fast inspection rates, enhanced by MIPS 5 software, AI-based defect classification, and real-time process control.
Key Features
- Flexible imaging modes: 2D Transmission, Off-Axis (2.5D), 3D SART, Dynamic Planar CT
- High-speed inline system with up to 6 views/sec (2D)
- Microfocus X-ray source (130 kV/40 W) with sealed, maintenance-free design
- CMOS flat panel detector with 50 µm resolution and 6 MP sensor
- Programmable motion system with up to 5 axes (X, Y, Z, U, V)
- Inspection angles up to 50° for hard-to-see joints
- Smart software: MIPS 5 with Auto-Rule Generation (ATC), SPC, and CAD import
- Inline conveyor with auto width adjustment (SMEMA compliant)
- Traceability with barcode scanner and MES integration (IPC-CFX, Hermes)
- Cleanroom-ready, compact design for SMT production environments
Specifications
| Feature | Specification |
|---|---|
| System Configurations | X2.5 (2D + Off-Axis), X3 (2D + Off-Axis + 3D CT) |
| X-ray Source | Sealed Microfocus, 130 kV / 40 W |
| Detector | CMOS flat panel, 50 µm pixel, 6 MP |
| Resolution | 3–4 µm/pixel |
| 3D CT Speed (X3) | SART: 1 s/FoV, Planar CT: 3 s/ROI |
| Inspection Speed (2D) | Up to 6 views/sec |
| Inspection Speed (Off-Axis) | Up to 5 views/sec |
| Inspection Area | Max: 460 × 360 mm |
| Sample Size Range | Min: 80 × 80 mm, Max: 460 × 360 mm |
| Sample Thickness | 0.8 mm – 10 mm |
| Max Sample Weight | 5 kg |
| Angle Shot Capability | Up to 50° |
| Assembly Clearance | Top: 35–50 mm, Bottom: 20–35 mm |
| Conveyor Height | Adjustable, 950 mm (SMEMA) |
| System Dimensions (H × W × D) | 1630 × 1800 × 1575 mm |
| System Weight | 2800 kg |
| Power Requirement | 400 VAC / 208 VAC, 3-phase, Max. 6 kW |
| Air Supply Requirement | 5–7 bar, <2 L/min (filtered, dry, oil-free) |
| Software Platform | MIPS 5 with ATC, CAD import, offline simulation |
| Traceability | Barcode reader, MES, SECS/GEM, IPC-CFX, Hermes |
Applications
Electronics & PCB Assembly
- Solder joint inspection of SMD, PTH, and THT components
- Voiding analysis in BGAs, QFNs, QFPs, and PIPs
- Press-fit and connector inspection with accurate 3D data
Power Electronics
- Inspection of cooling plates, power modules, and heat sinks
- Reliable void detection in high-mass solder joints
- 3D CT imaging for multi-layered assemblies
Automotive Electronics
- Real-time QA of safety-critical systems like ECUs and ADAS modules
- Fast inline inspection for high-reliability solder joints
- Full traceability integration for Tier 1/2 automotive compliance
Resources
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