Precision 2D, 2.5D, and 3D Imaging for Wire Bonds, Flip Chips, and Solder Joints
Product Overview
The XS Series offers a versatile platform of inline or standalone Automated X-ray Inspection (AXI) systems, purpose-built to support semiconductor, electronics, and high-reliability assembly environments. Designed with up to four advanced imaging modes, including Dynamic Planar CT, Off-Axis, Transmission, and Slice-Filter-Technique, the XS Series adapts to a wide range of inspection requirements with sub-micron resolution and high-speed throughput.
Three configuration tiers—Semiconductor, Semiconductor Pro Strip, and Semiconductor Pro Tray—enable ultra-high-resolution inspection of wire bonds, flip chips, and solder joints, with tailored handling options for JEDEC trays, steel carriers, and specialized formats.
Key Features
- Four imaging modes: 2D, 2.5D, 3D CT, and Slice-Filter-Technique™
- Dynamic Planar CT: 3D volume reconstruction at 3 sec/FoV
- Oblique angle inspection up to 30° for advanced wire geometry detection
- Sub-micron resolution (<1 µm/voxel) on Pro configurations
- Microfocus sealed X-ray source up to 160 kV
- Advanced Aspire CMOS flat-panel detector with 50 µm pixel pitch
- AI-based defect classification and slice analysis
- MIPS software with fast "Teach & Go" setup and automated calibration
- Machine learning algorithms for warpage compensation and fine defect recognition
- MES/SECS/GEM/IPC-CFX ready for Industry 4.0 integration
Specifications
| Feature | Specification |
|---|---|
| Inspection Modes | 2D, Off-Axis (2.5D), 3D (CT), Slice-Filter-Technique |
| Max Inspection Speed (2D) | 6 views/sec (Semiconductor, Pro Strip) |
| 3D CT Speed | 3 sec/FoV (all models) |
| X-ray Source | Sealed Microfocus, up to 160 kV, 20 W |
| Detector | Aspire CMOS FPD, 50 µm pixel pitch |
| Detector Resolution | 2400 × 2782 px (120 × 140 mm active area) |
| Frame Rate / Bit Depth | 25 fps / 14- or 16-bit |
| Max Resolution | <3 µm (Standard), <0.8 µm (Pro Strip), <1 µm (Pro Tray) |
| Max Inspection Angle | 30° oblique viewing |
| Max Sample Size (L × W) | Up to 330 × 200 mm (varies by config) |
| Min Sample Size | 80 × 20 mm (Strip) / 80 × 50 mm (Tray) |
| Max Sample Mass | 0.3 kg (Strip) / 2 kg (Tray) |
| Conveyor Height | 950 mm ± 30 mm (SMEMA) |
| System Dimensions (H × W × D) | 1760 × 1300 × 1600 mm |
| Weight / Power | 2500 kg / 2 kVA, 3-phase |
| Air Supply | 5–7 bar, <2 L/min, dry and filtered |
| Cleanroom Compatibility | ISO 6 / ISO 7 options |
| Connectivity | MES, SECS/GEM, IPC-CFX, Hermes, Industry 4.0 |
Applications
Semiconductor
- Wire bond inspection (≥0.6 mil): loop height, sweep, sagging, missing, lifted or broken wires
- Flip chip inspection: micro-bump defects, misalignment, micro-voids, bridging
- Multi-die and stacked die analysis with warpage correction and 3D imaging
Consumer Electronics
- High-speed inspection of densely populated BGA/µBGA assemblies
- Off-axis and CT analysis of ultra-compact chip interconnects
- Detection of solder shorts, voids, and opens in wearable devices
Resources
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